The film uniformity on magnetron sputtering with multi-workbench

摘要

This paper has presented a new type of multi-site magnetron sputtering system,which has more than one workbench. Based on the operating principle of the magnetron sputtering system with a circular plane target,a mathematical model was developed to simulate and discuss the influencing factors on the film thickness uniformity. The results of calculation and simulation showed that when the substrates are rotating axially and eccentrically,the targetsubstrate distance and eccentricity both affect the film thickness distribution. If the eccentricity is constant,the film thickness becomes thinner with increasing target-substrate distance,and the thickness uniformity tends to be improved. If the target-substrate distance is constant,the thickness uniformity becomes better then worse with increasing eccentricity. Moreover,if the substrate rotates axially and revolves round the target simultaneously,the thickness uniformity becomes better with increasing velocity ratio of axial rotation to revolution,and the effect of the thickness uniformity becomes smaller gradually if the ratio increases to a certain degree. Finally,we have taken relative experimental validation,and results comply with the simulation conclusion in general.