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Fabrication of Condenser Microphones on Silicon on Insulator Wafer

机译:绝缘体晶片上硅的冷凝器话筒的制作

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A silicon condenser microphone on an SOI (silicon on insulator) substrate using only one photo mask was fabricated. This microphone consists of a diaphragm with the thickness of 20 μm and the diameter of 2 mm, a SiO_2 insulative spacer (4-μm-thick buried oxide), and a 450-μm-thick silicon back plate with the meshed structures having extremely small (60 μm) hexagonal shaped acoustic holes. The gap between the 20-μm-thick silicon diaphragm and the back plate is 4 μm, which is determined by the thickness of the buried oxide in the SOI wafer. This microphone was confirmed to function as a static pressure sensor. The SOI microphone was also connected to an amplifier circuit, and exposed to the sound pressure of 110 dB at the frequency of 1 kHz. The microphone clearly responded to the input sound, and the output ac voltage of approximately 40 μV was detected.
机译:制造了仅使用一张照片掩模的SOI(绝缘体上的硅)衬底上的硅胶冷凝器麦克风。该麦克风由厚度为20μm的隔膜和直径为2mm,是SiO_2绝缘间隔物(4μm-粗掩埋氧化物),以及450μm厚的硅背板,具有极小的啮合结构(60μm)六边形声孔。 20-μm厚的硅隔膜和后板之间的间隙是4μm,其由SOI晶片中的掩埋氧化物的厚度决定。确认该麦克风用作静压传感器。 SOI麦克风也连接到放大器电路,并在1kHz的频率下暴露于110 dB的声压。麦克风清楚地响应输入声音,检测到大约40μV的输出交流电压。

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