Electrodeposition of Copper in Trenches From a Citrate Plating Bath

摘要

In 1997 IBM introduced copper as the electrical contact in their chips. The wires made of copper are about 40% less resistant than traditional aluminum wiring. In addition, copper shows less tendency to electromigration so, compared with aluminum, the use of copper improves the lifetime of the wire and the speed of chip (1). As an added advantage, copper can be electrodeposited at high deposition rates under ambient conditions.