ELECTRODEPOSITION BATH FOR FORMING POROUS CROCK-SHAPED COPPER PLATING FILM AND METHOD FOR FORMING POROUS CROCK-SHAPED COPPER PLATING FILM USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a technology capable of increasing specific surface area of a copper plating film.SOLUTION: An electrodeposition bath for forming a porous crock-shaped copper plating film contains (a) a tertiary amine having an aryl group which may have a substituent and (b) a tertiary amine having a long chain alkyl group which may have a substituent, in a copper pyrophosphate plating bath. A method for forming the porous crock-shaped copper plating film includes a step of electrodeposition using the same. The present invention also provides the porous crock-shaped copper plating film obtained by the method.SELECTED DRAWING: Figure 2