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High frequency N-polar GaN planar MIS-HEMTs on sapphire with high breakdown and low dispersion

机译:高频N极GaN平面MIS-HEMTS在蓝宝石上具有高击穿和低分散性

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N-polar planar GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) grown by metal-organic chemical vapor deposition on sapphire substrate with a high combination of power cutoff frequency (fmax) and three-terminal breakdown voltage (BVDS) as well as a decent DC-to-RF dispersion control are demonstrated. Compared to previously reported N-polar planar HEMTs, devices presented in this letter not only maintain comparable fmax/BVDS of 221 GHz/116 V, but also exhibit a mitigation of drain current collapse and ON-resistance dispersion. In addition, a higher output power of 5.43 W/mm at the same VDS,Q = 25 V and a reduction of efficiency drop with increasing VDS,Q were achieved by load-pull measurements at 10 GHz.
机译:N极平面GaN金属 - 绝缘体 - 半导体高电子迁移率晶体管(MIS-HEMT)在蓝宝石基板上的金属 - 有机化学气相沉积生长,具有高功率截止频率(FMAX)和三端击穿电压( BVDS)以及体面的DC到RF色散控制。与先前报道的N极平面垫相比,本信中提供的器件不仅保持了221GHz / 116 V的可比FMAX / BVD,而且还表现出漏极电流塌陷和导通电阻分散的减轻。另外,通过10GHz的负载 - 拉动测量实现,在相同VDS,Q = 25V和效率下降的较高输出功率,Q = 25V和随着VDS的效率降低。

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