首页> 外文会议>Proceedings of the 25th Biennial Lester Eastman Conference on High Performance Devices >High frequency N-polar GaN planar MIS-HEMTs on sapphire with high breakdown and low dispersion
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High frequency N-polar GaN planar MIS-HEMTs on sapphire with high breakdown and low dispersion

机译:蓝宝石上具有高击穿和低色散的高频N极性GaN平面MIS-HEMT

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摘要

N-polar planar GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) grown by metal-organic chemical vapor deposition on sapphire substrate with a high combination of power cutoff frequency (fmax) and three-terminal breakdown voltage (BVDS) as well as a decent DC-to-RF dispersion control are demonstrated. Compared to previously reported N-polar planar HEMTs, devices presented in this letter not only maintain comparable fmax/BVDS of 221 GHz/116 V, but also exhibit a mitigation of drain current collapse and ON-resistance dispersion. In addition, a higher output power of 5.43 W/mm at the same VDS,Q = 25 V and a reduction of efficiency drop with increasing VDS,Q were achieved by load-pull measurements at 10 GHz.
机译:通过在蓝宝石衬底上进行金属有机化学气相沉积而生长的N极平面GaN金属绝缘体半导体高电子迁移率晶体管(MIS-HEMT),具有高功率截止频率(fmax)和三端击穿电压( BVDS)以及体面的DC-RF分散控制得到了证明。与以前报道的N极平面HEMT相比,本文介绍的器件不仅保持221 GHz / 116 V的可比fmax / BVDS,而且还减轻了漏极电流崩溃和导通电阻色散的情况。此外,通过在10 GHz下进行负载拉力测量,在相同的VDS,Q = 25 V时,输出功率更高,为5.43 W / mm,并且随着VDS,Q的增加,效率下降减小。

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