Thermal Characterization of Endogenously Heated Printed Circuit Boards with Embedded Resistive Layers

摘要

This paper will focus on the thermal characterization of resistive layers in conjunction with printed circuit board (PCB) substrate material. The electrical parameters that are required to achieve endogenous heating up to temperatures of 200 °C and more are studied. Also the correlation between temperature and electrical resistance at the here used heating materials is investigated and described. Final thermal measurements on build-up samples with embedded heating layers are conducted and evaluated.