Next to well known wafer bonding technologies like silicon fusion bonding, anodic bonding, or seal glass bonding, eutectic bonding has still got a special importance today. Regarding further miniaturization and complex system integration also called "More than Moore", 3D integration technologies getting more and more significant. Especially the possibility to perform both a hermetically sealed package and electrical interconnects within one process is an important fact for wafer level packaging. Additionally the low process temperature up to 400°C is a favourable property of eutectic bonding using gold and silicon.
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