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RDF effect induced by source/drain doping in nano-scale UTB SOI MOSFET with nominally un-doped channel

机译:纳米级UTB SOI MOSFET中源/排水掺杂引起的RDF效应,具有名义上未掺杂通道

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SOI MOSFETs with un-doped channel are generally considered immune to random dopant fluctuation (RDF) effect. However in ultra-small MOSFETs, the lateral extension distribution of source/drain (S/D) impurity can make the “nominally” un-doped channel considerably doped, thus very likely resulting in an unexpected noticeable RDF effect. In this work, we investigate the unexpected RDF effect in UTB SOI MOSFETs with un-doped channel by device simulation. Results show that, for sub-20nm gate length devices, the S/D doping abruptness (δ) is required to be around 1 nm/dec to have an acceptable Vth variation caused by the unexpected RDF effect. This requirement seems too difficult to meet in the present or near future technologies. A new limit to scaling nano-scale SOI devices is thus revealed.
机译:具有未掺杂通道的SOI MOSFET通常被认为是无规掺杂剂波动(RDF)效应的免疫。然而,在超小MOSFET中,源/漏极(S / D)杂质的横向延伸分布可以使“名义上”的未掺杂通道相当掺杂,因此很可能导致意外的明显的RDF效应。在这项工作中,我们通过设备仿真调查UTB SOI MOSFET中的意外RDF效果。结果表明,对于子20nm栅极长度器件,S / D倾斜突然突出(δ)需要约1nm / dec,以具有由意外的RDF效应引起的可接受的V TH 变化。这一要求似乎太难以在现在或在未来的技术中满足。因此,揭示了缩放纳米级SOI器件的新限制。

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