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RDF effect induced by source/drain doping in nano-scale UTB SOI MOSFET with nominally un-doped channel

机译:在标称未掺杂沟道的纳米级UTB SOI MOSFET中,由源/漏掺杂引起的RDF效应

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SOI MOSFETs with un-doped channel are generally considered immune to random dopant fluctuation (RDF) effect. However in ultra-small MOSFETs, the lateral extension distribution of source/drain (S/D) impurity can make the “nominally” un-doped channel considerably doped, thus very likely resulting in an unexpected noticeable RDF effect. In this work, we investigate the unexpected RDF effect in UTB SOI MOSFETs with un-doped channel by device simulation. Results show that, for sub-20nm gate length devices, the S/D doping abruptness (δ) is required to be around 1 nm/dec to have an acceptable Vth variation caused by the unexpected RDF effect. This requirement seems too difficult to meet in the present or near future technologies. A new limit to scaling nano-scale SOI devices is thus revealed.
机译:通常认为具有未掺杂沟道的SOI MOSFET不受随机掺杂波动(RDF)的影响。但是,在超小型MOSFET中,源极/漏极(S / D)杂质的横向扩展分布可能会使“名义上”的未掺杂沟道得到大量掺杂,因此很可能导致意想不到的显着RDF效应。在这项工作中,我们通过器件仿真研究了具有未掺杂沟道的UTB SOI MOSFET中意外的RDF效应。结果表明,对于栅极长度小于20nm的器件,S / D掺杂突变率(δ)要求约为1 nm / dec,以具有由意外的RDF效应引起的可接受的V 变化。在当前或不久的将来的技术中,似乎很难满足这一要求。因此揭示了缩放纳米级SOI器件的新限制。

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