CHARACTERIZATION AND RELIABILITY EVALUATION OF SN-AG-CU-IN QUATERNARY SOLDER ALLOY

摘要

In the procedure of minimizing the amount of Ag in Pb-free solder alloy, the addition of small amount of In element significantly improves the wettability and mechanical properties of the alloy. Furthermore, the formulated Sn-Ag-Cu-In quaternary alloy formed metallographically stable and faultless interfaces with both Au/Ni and OSP/Cu pads, and exhibited better reliability than Sn-3.0Ag-0.5Cu composition in the joint properties.