Die to wafer 3D stacking for below 10um pitch microbumps

摘要

Processing of bump-less or embedded microbumps is introduced in this paper as an approach which enables scaling microbumps for below-10-μm pitches. Landing wafer is standard damascene process and in top wafer bumps are embedded in a soft backed polymer. Later, during thermo-compression bonding, this polymer is cured to bond two chips together. Process flow and results of TC bonding is discussed in this paper.