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Efficient statistical analysis of read timing failures in SRAM circuits

机译:SRAM电路中读取时序故障的高效统计分析

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A system-level statistical analysis methodology is described that captures the impact of inter- and intra-die process variations for read timing failures in SRAM circuit blocks. Unlike existing approaches that focus on cell-level performance metrics for isolated sub-components or ignore inter-die variability, the system-level performance is accurately predicted for the entire SRAM circuit that is impractical to analyze statistically via transistor-level Monte Carlo simulations. The accurate bounding of read timing failures using this methodology is validated with silicon measurements from a 64kb SRAM testchip in 90nm CMOS. We demonstrate the efficacy of this methodology for earlystage design exploration to specify redundancy, required sense amp offset, and other circuit choices as a function of memory size.
机译:描述了一种系统级统计分析方法,其捕获了模具和内部模具的影响对SRAM电路块中的读取时序故障的影响。与专注于隔离子组件的细胞级性能度量或忽略模芯间变性的现有方法不同,对整个SRAM电路进行准确地预测系统级性能,这对于通过晶体管级蒙特卡罗模拟进行统计分析而不切实际的SRAM电路。使用该方法的读取时序故障的准确界限通过来自90nm CMOS的64KB SRAM TESTCHIP的硅测量值验证。我们展示了这种方法对早期设计探索的效果,以指定冗余,所需的感觉放大器偏移和其他电路选择作为内存大小的函数。

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