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High Performance Schottky Barrier MOSFETs on UTB SOI

机译:UTB SOI高性能肖特基障屏MOSFET

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This paper presents fully-depleted short-channel Schottky barrier (SB) MOSFETs with silicidation induced dopant segregation of B at a low temperature of 450°C. The integration of nickel silicide combined with either As or B segregation significantly improves the switching performance of dopant-free SB-MOSFETs. The implantation dose dependence of the device characteristics is studied on long channel p- and n-type SB-MOSFETs. An enhanced device performance with higher on-currents and a strong suppression of the ambipolar behaviour, which is typical for SB-MOSFETs, is observed with increasing implantation dose. Short channel p-type SB-MOSFETs with a channel length of 80 nm show an on-current of 525 μA/μm at an I_(on)/I_(off)-ratio of 10~4, becoming competetive with state-of-the-art SB-MOSFETs.
机译:本文呈现出完全耗尽的短通道肖特基屏障(SB)MOSFET,硅化诱导的B在450℃的低温下的掺杂剂偏析。硅化镍与AS或B偏析结合的整合显着提高了无掺杂剂SB-MOSFET的切换性能。在长通道P和N型SB-MOSFET上研究了器件特性的植入剂量依赖性。随着植入剂量的增加,观察到具有较高电流的增强的设备性能和对SB-MOSFET的典型的典型的Ampolar行为的强大抑制。具有80nm的通道长度的短通道P型SB-MOSFET显示在I_(ON)/ I_(OFF)-RATIO为10〜4的电流为525μA/μm,具有与状态的竞争力最艺术SB-MOSFET。

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