This paper discusses challenges for multi-scale Finite Element (FE) modeling in microelectronics. Its miniaturization and multi-scale nature is an enabler for in Healthcare and Well-being markets. Function integration and miniaturization enable microelectronic products having functionalities such as rollable display (Figure 1), wireless connectivity & GPS, beaming, illumination systems, body health sensor, DNA analyzer, and many many more. For multi-scale FE modeling, their added value could be in preventing reliability problems and enabling faster functionality integrations in microelectronics resulting in shorter time to market and lower cost. The challenge in the area of multi-scale modeling is to understand the products aim, functionality and the full processing towards the end product. Key for FE modeling in microelectronics is to combine this with modeling expertise and make the right modeling assumptions and simplifications efficiently. Applications of multi-scale modeling can already be found in areas where small geometries cannot be modeled within the total models geometry due to convergence and CPU limitations. Figure 2 shows an example of local IC interconnect structures that cannot be modeled efficiently in a total package model. More applications are found in developing Cu/LowK bond pad structures, IC passivation & interconnect reliability in SiPs (System in Packages), and board level solder reliability. Herein, the multi-scale modeling is applied because of limiting factors such as large size differences, convergence problems, and limited CPU available. We propose to apply available multi-scale methodologies from now on more aggressively for its enabling factors such as faster model development, higher simulation flexibility, and more efficient simulations. We have the chance to do so because of the innovative and initiative FE community, supported by the multi-scale approaches becoming available in commercial FE softwares. Next to this, modeling is proving to be a key tool for showing product performance, risks, etc. prior to the (expensive) physical prototyping and testing. Figure 3 shows an example of multi-scale modeling for fast results. It enables wire reliability simulation of one wire type (local model) for multiple locations in the package (global model). Secondly, it enables simulating multiple wire materials, types, etc. using boundary constraints from the global package simulation. We like to conclude that we see important challenges in gaining application knowledge of microelectronics products and convert this into making efficient and effective choices for applying multi-scale approaches with a focus on reducing modeling and simulation time.
展开▼
