HEAD-IN-PILLOW: ALARM STILL RINGING? A CONTINUATION STUDY ON KNOWN CHEMICAL AND MECHANICAL FACTORS IN BGA NON-WET

摘要

Intended as a continuation study to work presented at SMTAi 2009, this paper will further review findings related to the chemical and mechanical causes of BGA/CSP bump to SMT paste non-wet, known also as Head-In-Pillow (HIP), prevalent within the industry. The paper will explore ball attach chemistry variation, deflux processes and other factors affecting the issue as introduced in the previous work. Both no-clean and water-soluble processes will be reviewed.