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Study the Effect of Annealing Temperature on Optical and Structural Properties of Zinc Oxide Thin Film Prepared by Thermal Chemical Vapor Deposition

机译:研究退火温度对热化学气相沉积制备的氧化锌薄膜光学和结构性能的影响

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Zinc oxide (ZnO) thin films deposited on silicon and glass substrate were prepared using chemical vapor deposition (CVD) method utilizing zinc acetate dihydrate as the zinc sources. The deposited film then annealed at 300°C to 500°C for 1 hour. The optical and structural properties of ZnO thin films were characterized using photoluminescence (PL) and Scanning Electron Microscopy (SEM) respectively. SEM images show that the ZnO thin film on silicon substrate formed unique morphology of flower-like and ball-shaped structures at annealing temperature 300°C and 400°C. Increasing annealing temperature to 450°C for ZnO deposited on glass substrate had increased the grain size of particle which implies the improvement of crystalline grain of thin film. PL results observed that the defect of oxygen vacancy decreased after annealing process for films deposited on silicon substrate. The blue peak emission at 437 nm appears only on the glass substrate. Based on the highest PL intensity value, the optimum annealing temperature for silicon and glass substrate is 350°C and 450°C respectively.
机译:使用与锌源为锌源的硫酸锌二水合物制备沉积在硅和玻璃基板上的氧化锌(ZnO)薄膜。然后将沉积的膜在300℃至500℃下退火1小时。使用光致发光(PL)和扫描电子显微镜(SEM)的表征ZnO薄膜的光学和结构性能。 SEM图像显示硅衬底上的ZnO薄膜在退火温度300℃和400℃下形成了花样的独特形态和球形结构。向沉积在玻璃基板上的ZnO的退火温度升高至450℃,粒径增加了颗粒的晶粒尺寸,这意味着薄膜的晶粒的改善。 PL结果观察到沉积在硅衬底上的薄膜退火过程后氧空位的缺陷降低。 437nm处的蓝峰发射仅出现在玻璃基板上。基于最高PL强度值,硅和玻璃基板的最佳退火温度分别为350℃和450°C。

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