2.0mils au wire wedge bonding process characterization to eliminate lift bond on accelerometer device

摘要

Au wire thermosonic wedge bonding is applied for die to die interconnect on accelerometer device as traditional Al thermo-compression wedge bonding is not suitable for this application due to the constraint of fine pitch silicon bond pad and fragile bond pad structure of MEMS devices. With thermosonic wedge bonding, a few of lifted (wedge) bonds were reported during end customer application, the lifted bond causes malfunction of the device.