Recently, high frequency has been broadly applied in communication and broadband technologies, and even mini-electronic devices. Signal propagating delay and signal transmitting loss in PCB is strongly relevant to frequency range at high frequency. Therefore, dielectric properties of laminate material are more and more concerned. Additionally, lead-free solder process application for PCB/PCBA has been pushed and tended to maturate since ROHS directive and other environmental regulations were done in the past several years. Laminate materials of high thermal resistance were relatively developed and are successfully applied for lead-free solder process. However, the elimination of halogen compounds in laminate material is being pushed by some assembly factories or end users. And more and more end users go into this rank. Based on this background, a new type of halogen free & low loss laminate material was developed for high frequency PCB application. It is quite environment-friendly material due to its very small halogen property in laminate rein. Its excellent dielectric properties, especially low dissipation factor, are discussed in this paper. Its good heat resistance, low thermal expansion and low moisture absorption are also shown in this paper, which indicates it is compatible with lead-free assembly.
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