A Novel Halogen-Free, Phosphorous-free and Heat Resistant Material for Copper clad laminate

摘要

Brominated and phosphorous-containing type epoxy resins are important binders for current flame retardant CCL (copper clad laminate). Nevertheless, they will cause environment problems. Brominated type resins will generate dioxins from inappropriate incineration condition and phosphorous type resins may cause the pollution of aquatic environment. On July 1, 2006, two important directives on environment protection were releasecedy European Union, i.e., RoHS and WEEE. The Sn-Pb solder shouldbe replaced by lead free type solder and the JR Reflow will increase from 200?°C to 255?°C. Given the above, we developed a new halogen-free and phosphorous-free composition, which is comprising nitrogen-containing resin, inorganic filler and modifier . The nitrogen and inorganic filler impart CCL with flame-retardant properties and render CCL more environment-friendly. The new product is also good in heat properties and can meet the specification of IPC41O1B.