General Trend of DRAM Stacking Design and Reliability in Server Application - 2008 3D/SiP Advanced Packaging Symposium - (PPT)

摘要

Server system will continuously push DRAM stacking technology; DRAM Die stacking is mainstream; BGA stacking helps DRAM stacking yield; DRAM date rate, thermal management, assembly cost, VLP form factor will drive new stacking technologies and post new challenges on reliability.