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THE EVALUATION OF CONFORMAL COATINGS UNDER CONDENSING CONDITIONS: PART 1

机译:冷凝条件下保形涂层的评价:第1部分

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Conformal coatings are applied to protect electronic assemblies from adventitious environmental factors, which include, for example, corrosive gases, corrosive fluids and high humidity. Whenever there is a significant level of humidity, there is always the opportunity for parts of the assembly to drop beneath the dew point, thus resulting in the formation of condensed water on the surface of the assembly, which can significantly reduce the insulation resistance of the boards surface, resulting in malfunctioning electronics. While the characterisation of coating performance under high humidity conditions is detailed, in well accepted IPC and IEC standards, the performance and testing under condensing conditions is not so well developed. This situation largely reflects the hardware challenge. Most humidity chambers are designed to achieve stable, well controlled humidity and temperature conditions, but none of these offer condensing options. Therefore the user has to improvise. A common approach to attempt to achieve condensing conditions is to ramp at a fast enough rate to cause condensation, a feature the humidity chamber designers have by and large, successfully managed to remove. An immediate drawback of this approach is that chambers of different designs will perform differently, and will be sensitive to small drops in cooling performance. An alternative approach is the BMW test K15 from GS 95024-3-1, where a tray of water is introduced to the chamber and heated to cause excess moisture, and hence condensation. The sensors in the chamber detect the additional moisture and will work to reduce the humidity level to the required set-point. Thus, once again, the level of experimental control is poor, and the actual conditions on the test-sample are not known. The NPL, have developed a new approach, where the test board is mounted on a substrate whose temperature can be independently controlled without changing the ambient condition. Thus, the temperature of the test board can be depressed below ambient to any desired point and hence, produce condensation at different levels. It is then, therefore, straightforward to cycle between condensing and non-condensing conditions on the test board in a constant ambient environment. The technique has been demonstrated to be repeatable and controllable, with the user able to select a temperature differential that matches their worst in-use conditions, or to understand the performance of their system under a range of condensing conditions. The data for a range of conformal coatings are presented, and correlated back to the conformal coating material type, and coverage and thickness by cross-sectioning.
机译:应用共形涂层以保护电子组件免受偶偶环境因素,包括例如腐蚀性气体,腐蚀性流体和高湿度。每当有显着水平的湿度时,总是有机会将组件的部分放在露点下方,从而导致组装表面上的冷凝水形成,这可以显着降低绝缘电阻板表面,导致电子器件发生故障。虽然在高湿度条件下的涂层性能的表征是详细的,但在良好的IPC和IEC标准下,凝结条件下的性能和测试并不是如此开发。这种情况在很大程度上反映了硬件挑战。大多数湿度房间设计用于实现稳定,良好控制的湿度和温度条件,但这些都不是这些提供冷凝选项。因此,用户必须即兴创作。尝试实现冷凝条件的常用方法是以足够快的速率斜坡以引起冷凝,湿度室设计人员具有且大,成功地拆卸的特征。这种方法的立即缺点是不同设计的房间将不同地执行,并且对冷却性能的小滴会敏感。另一种方法是GS 95024-3-1的BMW测试K15,其中将水托盘引入腔室并加热以引起多余的水分,因此凝结。腔室中的传感器检测到额外的水分,并将工作降低到所需设定点的湿度水平。因此,再一次,实验控制水平差,并且测试样品上的实际条件不知道。 NPL,已经开发出一种新的方法,其中测试板安装在其温度可以独立地控制的基板上而不改变环境条件。因此,可以将测试板的温度低于环境温度以任何所需的点,并且因此产生不同水平的凝结。因此,它是直接的,以在恒定的环境环境中在测试板上的冷凝和非冷凝条件之间循环。该技术已经证明是可重复和可控的,并且用户能够选择与其最差的内使用条件匹配的温差,或者在一系列冷凝条件下理解其系统的性能。通过横截面呈现一系列共形涂层的数据,并将其与保形涂层材料类型相关,并通过横截面覆盖和厚度。

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