The Great SAC Debate: Comparing the Reliability of SAC305 and SAC405 solders in a variety of applications-(PPT)

机译：伟大的SAC辩论：在各种应用中比较SAC305和SAC405焊料的可靠性 - （PPT）

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

Which SAC alloy should be used for electronics assembly? North American and European Industries originally favoured SnAg3.8Cu0.7 (SAC405). Asian Industry originally favoured SnAg3.0Cu0.5 (SAC305). Current trend is towards SAC305. Lower Silver content means lower cost for SAC305 alloy. However, there is limited reliability data for SAC305 in higher reliability applications. Is SAC305 sufficiently reliable for high reliability applications?

机译：哪种Sac合金应该用于电子组装？北美和欧洲工业最初受到SNAG3.8CU0.7（SAC405）。亚洲工业最初受到攻击Snag3.0cu0.5（SAC305）。目前的趋势是SAC305。较低的银含量意味着SAC305合金的成本更低。但是，在更高可靠性应用中，SAC305的可靠性数据有限。 SAM305是否足以适用于高可靠性应用？

著录项

来源
《International Conference on Soldering Reliability》|2007年||共34页
会议地点
作者
Heather McCormick; Polina Snugovsky; Craig Hamilton; Zohreh Bagheri; Simin Bagheri;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类 TG4-53;
关键词

相似文献

外文文献
中文文献
专利

1. Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation [J] . T.T. NGUYEN, D. YU, S.B. PARK Journal of Electronic Materials . 2011,第6期

机译：通过数字图像关联表征实际的SAC105，SAC305和SAC405焊点的机械性能
2. Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation [J] . T. T. Nguyen, D. Yu, S. B. Park Journal of Electronic Materials . 2011,第6期

机译：通过数字图像关联表征实际的SAC105，SAC305和SAC405焊点的机械性能
3. Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405) [J] . P. Manoj Kumar, G. Gergely, D. K. Horváth, Powder Metallurgy Progress: Journal of Science and Technology of Particle Materials . 2018,第1期

机译：研究纯无铅锡焊材料的微观结构和机械性能（SAC305和SAC405）
4. The Great SAC Debate: Comparing the Reliability of SAC305 and SAC405 solders in a variety of applications-(PPT) [C] . Heather McCormick, Polina Snugovsky, Craig Hamilton, International Conference on Soldering Reliability . 2007

机译：伟大的SAC辩论：在各种应用中比较SAC305和SAC405焊料的可靠性 - （PPT）
5. Thermal cycling reliability of lead-free solders (SAC305 and tin(3.5)silver) for high temperature applications [D] . George, Elviz. 2010

机译：用于高温应用的无铅焊料（SAC305和锡（3.5）银）的热循环可靠性
6. 3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity [O] . Youjin Kim, Jooheon Kim 2020

机译：3D通过SAC305焊料合金的聚结行为在环氧复合材料中互连氮化硼网络作为增强导热率的桥接材料
7. THERMAL CYCLING RELIABILITY OF LEAD-FREE SOLDERS (SAC305 AND SN3.5AG) FOR HIGH TEMPERATURE APPLICATIONS [O] . George, Elviz 2010

机译：高温应用无铅焊料（SAC305和SN3.5AG）的热循环可靠性

The Great SAC Debate: Comparing the Reliability of SAC305 and SAC405 solders in a variety of applications-(PPT)

摘要

著录项

相似文献

相关主题

期刊订阅