Effect of Thermomigration in Lead-Free Solder Alloy Mechanical Properties-(PPT)

机译：热迁移在无铅焊料合金机械性能 - （PPT）中的影响

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Cu migrates to cold side as shown by concentration profile. Hardness decreases in hot side, and increases in cold side after thermomigration.

机译：Cu迁移到冷侧，如浓度曲线所示。硬度在热侧减小，热缩略后的冷侧增加。

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《International Conference on Soldering Reliability》|2007年||共22页
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作者
M. F. Abdulhamid; C. Basaran; D. C. Hopkins;
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中图分类 TG4-53;
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4. Effect of Thermomigration in Lead-Free Solder Alloy Mechanical Properties-(PPT) [C] . M. F. Abdulhamid, C. Basaran, D. C. Hopkins International Conference on Soldering Reliability . 2007

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7. Thermomigration in lead-free solder joints [O] . Mohd F. Abdulhamid, Shidong Li, Cemal Basaran 2015

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Effect of Thermomigration in Lead-Free Solder Alloy Mechanical Properties-(PPT)

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