Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level-(PPT)

摘要

Lead-free can be achieved consistently: Process optimization is key. Insuring components and boards meet lead-free. Process capabilities is critical. Understanding flux and alloy behaviors is important. Defects will be low and quality high in a stable optimized process. Dross rate not necessarily higher than leaded.