Solder Joint Reliability in High Reliability Application for QFN Type Packages-(PPT)

摘要

The authors would like to thank Chuan Cheah, Hai-Tien Shen and the engineering and management teams from International Rectifier for their supports on all the materials and daisy chain package designs. Also thank to John Gileta, Weerasiri (Siri) Nanayakkara and the process team from Sanmina-SCI (Montreal) who provided the extended support in all the assemblies and reworks. Also thank to the PART Lab from Sanmina-SCI (San Jose) who provided their expertise in failure analysis. Last but not least, thank to Alcatel-Lucent, International Rectifier and Sanmina-SCI Corp management for their support in making this study a successful one.