Reliability Analysis of Solder Joint Quality on J-Lead Ceramic Oscillators Using Highly Accelerated Life Testing (HALT) with Lead and Lead-Free Compositions

摘要

The reliability of electronic components was investigated using HALT methods to determine the relative reliability of tin/lead soldered part versus lead-free soldered parts. The test process revealed insight into the methods, including the effectiveness of HALT testing and vibration resonance dwell testing. Both lead-free and tin/lead terminations sustained all environmental stresses applied.