New experimental approaches are demonstrated to reveal more detailed physical characteristics that govern the performance and reliability of compliant press-fit pin/plated through hole assemblies as compared to common methods involving peak insertion and withdrawal force measurements. These approaches include: 1) measurement of the withdrawal force-displacement profile with high-speed techniques, 2) micrcdisplacement tests involving displacement in the micron range, and 3) long-term cyclic microdisplacement tests in a controlled environment. The results of these teats provide, respectively, information on: 1) the withdrawal energy and contact area, 2) the stiffness of the assembly, which relates to bond strength and contact area, and 3) the effects of fretting from thermal displacement cycles.
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