首页> 外文OA文献 >Investigation of Agitation Effects on Electroplated Copper in Multilayer Board Plated-Through Holes in a Forced-Flow Plating Cell

【2h】

Investigation of Agitation Effects on Electroplated Copper in Multilayer Board Plated-Through Holes in a Forced-Flow Plating Cell

机译：强制流镀单元中多层板镀通孔中电镀铜的搅拌效果研究

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Werner Engelmaier; Thomas Kessled;
展开▼
作者单位

展开▼
年度 2016
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface Plating in acidic copper solution with and without polyethylene glycol [J] . Y. Liu, J. Wang, L. Yin, Journal of Applied Electrochemistry . 2008,第12期

机译：电镀参数和溶液化学性质对在电镀铜-焊料界面处的空洞倾向的影响在酸性铜溶液中（有或没有聚乙二醇）电镀
2. The effects of ultrasonic agitation on supercritical CO2 copper electroplating [J] . Chuang Ho-Chiao, Yang Hsi-Min, Wu Guan-Lin, Ultrasonics sonochemistry . 2018,第Pta1期

机译：超声搅拌对超临界CO2铜电镀的影响
3. Low fractal dimension modified drilling-hole wall for PTFE high-frequency board copper plating with plasma treatment [J] . Zhou Guoyun, Gou Xueping, Jin Xiaofeng, Journal of Applied Polymer Science . 2019,第41a42期

机译：用于PTFE高频板铜电镀具有等离子处理的低分形尺寸改良钻孔孔墙
4. HOW MUCH REWORK IS TOO MUCH? : THE EFFECTS OF SOLDER JOINT REWORK ON PLATED-THROUGH HOLES IN MULTILAYER PRINTED WIRING BOARDS [C] . Ann Garrison, Norma Lee Todd, Mike Lee, 1994 international electronics packaging conference . 1994

机译：多少返工？：焊接工艺对多层印刷线路板中贯通孔的影响
5. Microscopic and spectroscopic investigation of: I. Copper-additive systems in electroplating bath. II. Supported phospholipid bilayer systems. [D] . Feng, Zengqi Vivian. 2005

机译：显微镜和光谱学研究：I.电镀液中的铜添加剂系统。二。支持的磷脂双层系统。
6. Effect of Copper Sulfate and Sulfuric Acid on Blind Hole Filling of HDI Circuit Boards by Electroplating [O] . Pingjun Tao, Yugan Chen, Weitong Cai, 2021

机译：硫酸铜和硫酸对电镀HDI电路板盲孔填充的影响
7. A new copper electroplating bath for production of minute holes and multilayer printed wiring boards. [O] . Shozo MIZUMOTO, Hidemi NAWAFUNE, Tamao KOJIMA, 1990

机译：用于生产微孔和多层印刷线路板的新型铜电镀浴。
8. Evaluation of multilayer printed wiring boards by metallographic techniques: An illustrated guide to the preparation and inspection of plated-through hole test coupons based on the requirements of Mil-P-55110D [R] . Jellison, J. 1986

机译：通过金相技术评估多层印刷线路板：根据mil-p-55110D的要求制备和检查镀通孔测试试样的图解指南

Investigation of Agitation Effects on Electroplated Copper in Multilayer Board Plated-Through Holes in a Forced-Flow Plating Cell

著录项

引文网络

相似文献

相关主题

期刊订阅