In the paper basic investigations for the nondestructive quality testing methods for MEMS (Micro-Electro-Mechanical Systems) are presented that can be applied on wafer level in early stage of the manufacturing process. The dynamic measurements of test specimen are performed by laser-Doppler-vibrometry (LDV). Finite Element (FE) models with different specifications are created to identify parameters from the measured eigenfrequency values. Different aspects of the numerical results and of experimental investigations of dynamic properties are presented for pressure sensor test structures. Results of identification of one and more parameters are shown.
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