Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes

摘要

The termination finish of Small Output Integrated Circuit (SOIC) and Small Output Transistor (SOT) chip components were converted from Pb-free to Sn-Pb (backward conversion) and vice versa (forward conversion). The motivation for these conversions is due to a combination of factors such as the supply chain constraints on component availability, European Union's (EU) legislation on "Restriction of Hazardous Substances" (or RoHS) , and the growth of tin whiskers on matte tin finish components. The conversions were performed using a "Robotic Stripping and Solder Dipping Process", and the mechanical reliability of the converted components was evaluated through lead pull testing.