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Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints

机译:测量基材和组件的光洁度对各向同性导电胶粘剂接头可靠性的影响

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Purpose - As the transition away from lead-containing solders gathers momentum, isotropic conducting adhesives (ICAs) are being considered as possible replacements for conventional SnPb solder in a range of applications. Consequently, the reliability of ICA joints is under scrutiny. The purpose of this paper is to report the effect of printed circuit board (PCB) and component finishes on the reliability of ICA joints. Design/methodology/approach - Previous work by the authors identified a suitable test regime to generate relevant reliability data. In the present work, those tests are employed to investigate whether the finishes on the components and/or PCBs have any effect on the reliability of the ICA joints after exposure to damp heat conditions. Findings - The effect of different finishes is found to be very adhesive material dependent. Two adhesives are studied, and for one material the joint reliability is relatively unaffected by changes in component or PCB surface finish. However, for the second material, and components with a high-tin content-plated finish, the joints display a less stable resistance. The surface finish on the PCB is found to have a smaller effect on joint reliability than the component finish, with results dependent on adhesive material type. Performance with one material exhibited little difference in reliability irrespective of the PCB surface finish. For the second material, the joint reliability performance with components having the electroless nickel/immersion gold finish, is not as good as that with components having the immersion tin or silver finishes. Originality/value - The paper shows that surface finish is an important factor in determining the conductivity of ICA joints during exposure to the 85℃/85%RH environment. Systems containing tin are more prone to lose conductivity and, conversely, noble metal systems are more immune to degradation. This is a major concern as the industry is showing many signs that the component termination of choice will be pure tin.
机译:目的-随着从含铅焊料的转移势头越来越大,各向同性导电胶(ICAs)被认为可以在许多应用中替代常规SnPb焊料。因此,ICA关节的可靠性受到严格审查。本文的目的是报告印刷电路板(PCB)和组件表面处理对ICA接头的可靠性的影响。设计/方法/方法-作者先前的工作确定了合适的测试方案来生成相关的可靠性数据。在当前的工作中,这些测试用于调查暴露在潮湿环境中的部件和/或PCB的表面处理是否对ICA接头的可靠性有任何影响。发现-发现不同饰面的效果非常依赖于粘合材料。研究了两种粘合剂,对于一种材料,接合可靠性不受组件或PCB表面光洁度变化的影响。但是,对于第二种材料以及具有高锡含量镀层的部件,接头的抵抗力较差。发现PCB上的表面光洁度对接合可靠性的影响小于组件光洁度,其结果取决于粘合剂材料的类型。不管PCB的表面光洁度如何,用一种材料制成的性能在可靠性上几乎没有差别。对于第二种材料,具有化学镀镍/浸金涂层的组件的联合可靠性性能不如具有浸锡或银浸涂层的组件的联合可靠性。原创性/价值-本文表明表面光洁度是确定ICA接头在85℃/ 85%RH环境中暴露时的电导率的重要因素。含锡的体系更容易失去导电性,相反,贵金属体系更不易降解。这是一个主要问题,因为该行业正显示出许多迹象表明选择的组件端接将是纯锡。

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