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Current Status and Perspective of High-k Gate Stack Materials Engineering for Further Scaled CMOS

机译:高k门堆材料工程的当前状态和透视进一步缩放CMOS

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High-k dielectric materials and technology have been intensively investigated over the past ten years, and are now just at the stage before production. A number of new challenges and hopes have been found. Some of these challenges are related to processing or material optimization issues. This is because the optimal process parameters must be different from those currently used in poly-Si/SiO{sub}2/Si system. However, most issues seem to be related to the intrinsic properties of high-k dielectric materials. We would, therefore, like to discuss some key challenges that must be addressed to further advance Si-CMOS.
机译:在过去十年中,高k介电材料和技术已经密集调查,现在就在生产前的舞台上。已经发现了许多新的挑战和希望。其中一些挑战与加工或材料优化问题有关。这是因为最佳过程参数必须与当前用于Poly-Si / SiO {sub} 2 / Si系统中使用的参数不同。然而,大多数问题似乎与高k介电材料的内在性质有关。因此,我们希望讨论必须解决的一些关键挑战,以进一步推进SI-CMOS。

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