首页> 外文会议>Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS >MEMS as Low Cost High Volume Semiconductor Solutions It's all in the Packaging and Assembly
【24h】

MEMS as Low Cost High Volume Semiconductor Solutions It's all in the Packaging and Assembly

机译:MEMS作为低成本高批量半导体解决方案,这一切都在包装和组装中

获取原文

摘要

Micro-electromechanical (MEMS) oscillators are now in production and shipping in quantity. Early development of micro mechanical devices provided the understanding that metal beams could be fabricated and they would resonate as a time reference. The issues of performance and price have prevented silicon entry into the quartz dominated market until recent developments in semiconductor processing and assembly. Today MEMS oscillators are the world's smallest programmable precision oscillators and are displacing quartz technology in the +/- 50 ppm accuracy spec. New oscillators extend the technology with spread spectrum, voltage control, and improved jitter performance. New ultra-thin packaging, made possible by the small encapsulated MEMS resonators, provides the word's thinnest precision oscillators.
机译:微机电(MEMS)振荡器现在生产和运输数量。微型机械装置的早期发展提供了理解,可以制造金属束并且它们将作为时间参考共振。绩效和价格的问题阻止了硅进入石英主导市场,直到半导体加工和组装的最新发展。如今,MEMS振荡器是世界上最小的可编程精密振荡器,并以+/- 50 ppm精度规格置换石英技术。新振荡器通过扩频,电压控制和改进的抖动性能扩展了该技术。新的超薄包装,由小封装的MEMS谐振器实现,提供了Word的最薄精密振荡器。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号