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Hot gas stream application in micro-bonding technique

机译:微粘接技术的热气流应用

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摘要

This paper presents a new concept for bonding micro-parts with dimensions in the range of 50 μm to 300 μm. Two different kinds of adhesives - polyurethane adhesive foil and hot melt glue - were applied to a basic substrate by different techniques. The focused and concentrated hot gas stream softened glue which had been applied in a solid state. Micro-parts were then embossed in the softened glue, or covered and shielded by it. In this way, a rigid and compact bond was obtained after cooling. For the positioning of micro-parts (optical fibers), it has been necessary to manufacture adequate V-grooves. Finite element analyses using the ANSYSTM program package were performed in order to evaluate parameters which govern the heat transfer to the adhesive and substrate respectively. Experimental results are in good agreement with results obtained by the numerical simulations. The advantages of this new approach are small system size, low capital costs, simple usage, applicability to many material combinations, easy integration into existing production lines, etc.
机译:本文提出了一种新的概念,用于粘合微部件,尺寸在50μm至300μm的范围内。通过不同的技术将两种不同种类的粘合剂 - 聚氨酯粘合剂箔和热熔胶胶水施加到碱性底物上。聚焦和浓缩的热气流软化胶水,其以固态应用。然后将微零件压在软化的胶水中,或通过它覆盖并屏蔽。以这种方式,冷却后获得刚性和紧凑的粘合剂。为了定位微零件(光纤),需要制造足够的V槽。使用Ansystm程序包进行有限元分析,以便分别评估控制传热和基板的参数。实验结果与通过数值模拟获得的结果吻合良好。这种新方法的优势是系统尺寸小,资金成本低,使用简单,适用于许多材料组合,易于集成到现有的生产线等。

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