Acid Gold Plating and Palladium Nickel in Electronic Applications An Update

摘要

This paper will provide a technology update on the state of the art processes for both Palladium Nickel and Acid Gold, it will explore the technical aspects and also the financial implications as a result of changing metal prices. Data will be presented giving performance data on Porosity, Contact Resistance and Corrosion related to thickness reduction. Newly developed processes will be highlighted and their features and benefits explored. New applications and trends in Connector, Semi Conductor Lead Frame and Microelectronics will presented.