Application of a Colloidal Hydroxide Solution as a Substitute for a Palladium Catalyst in Nickel-Phosphorus Electroless Plating

摘要

A colloidal hydroxide solution consisted of nickel sulfate, copper sulfate, and tartaric acid was prepared as a substitute for a palladium catalyst in nickel-phosphorus electroless plating. The colloids were adsorbed on an ABS resin substrate and then reduced chemically to produce activated sites for electroless plating. After nickel-phosphorus electroless plating, the articles were used for the evaluation of the 90°peeling strength and of the initial covering velocity with the nickel-phosphorus film during the electroless plating. Results indicated the following.