palladium catalyst application solution comprising palladium ammine complex salt aqueous solution and electroless nickel plating of the copper wiring board using the same how

摘要

PROBLEM TO BE SOLVED: To provide a means for obtaining an ultrafine metal wiring film substrate which is free from short circuit between metal wiring and deposition of nickel in a wiring space part, and in which a copper wiring surface is uniformly covered with nickel, even in a polyimide film substrate having an ultrafine copper wiring circuit wherein the wiring width (L) and the wiring interval (S) are each 15 μm or less.;SOLUTION: After subjecting a polyimide film substrate having a fine copper wiring circuit to degreasing and acid cleaning, the resulting polyimide film substrate is immersed into a palladium ammine complex salt aqueous solution containing ammonium ions in an excess amount to palladium ions (divalent) for a certain time to substitute the surface of the copper wiring with palladium. Thereafter, the resulting substrate is subjected to acid cleaning and pure water shower cleaning to remove the complex salt aqueous solution adhering in excess, and plating is performed by using a commercially available electroless nickel plating solution.;COPYRIGHT: (C)2013,JPO&INPIT