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Estimation of Device Parameters and C-V Modeling of Pulsed Laser Deposited Phosphorus Doped Carbon/p-Silicon Heterostructure

机译:脉冲激光沉积磷掺杂碳/ P硅异质结构的装置参数估计和C-V型造型

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A heterostructure, fabricated by depositing phosphorus (P) doped carbon thin film, thickness of which is about 200 nm, on boron doped crystalline silicon (Si) substrate by pulsed laser deposition (PLD) technique, is studied in terms of its opto-electronic characteristics. Optical transmittance-reflectance measurements, temperature dependent conductivity data and the current density-voltage (J-V) characteristics of the heterostructure are analyzed to estimate device parameters, such as built-in potential, reverse saturation current density, intrinsic carrier concentration and donor concentration in the carbon side of the device for different P content in the target material for carbon. The estimated device parameters are seen to improve with the increase in P content in the target for up to 5% of P. But for 7% of P in the target, the device performance deteriorates. Using these device parameters, capacitance-voltage (C-V) characteristics of the device is simulated. The results are then compared with the experimentally obtained C-V characteristics. The detailed analyses suggests diffusion of P atoms from the film into the Si region during the film deposition by pulsed laser ablation and thus the formation of a P-I-N device rather than a simple P-N junction device. The width of the I region and diffusion co-efficient of P into the Si are estimated and the values are found to be in the acceptable range.
机译:通过脉冲激光沉积(PLD)技术,通过沉积磷(P)掺杂碳薄膜,由脉冲激光沉积(PLD)技术在硼掺杂晶体硅(Si)衬底上的厚度为约200nm的异质结构。特征。光学透射率 - 反射率测量,分析异质结构的温度依赖电导率数据和电流密度 - 电压(JV)特性以估计装置参数,例如内置电位,反向饱和电流密度,内在载流子浓度和供体浓度装置的碳侧,用于碳的目标材料中的不同P含量。估计的装置参数被视为在目标中的P含量增加到5%的P.但是对于目标中的7%,装置性能劣化。使用这些设备参数,模拟了设备的电容 - 电压(C-V)特性。然后将结果与实验获得的C-V特性进行比较。详细分析表明,通过脉冲激光烧蚀在膜沉积期间,P-I-N器件的形成而不是简单的P-N结装置,该详细分析表明P原子在膜沉积中扩散到Si区域中。估计I区域和扩散的宽度估计P进入Si,并且发现该值在可接受的范围内。

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