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Development of ZnO-based thin film transistors and phosphorus-doped ZnO and (Zn, Mg)O by pulsed laser deposition.

机译:通过脉冲激光沉积开发基于ZnO的薄膜晶体管和掺磷的ZnO和(Zn,Mg)O。

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摘要

Top-gate type ZnO-based TFTs were fabricated on glass substrate via photolithography and wet chemical etching processing. The ZnO layers were deposited using pulsed laser deposition (PLD). N-channel depletion-mode operation was shown for the undoped ZnO and P-doped ZnO thin film transistors. The current-voltage measurements demonstrated an enhancement-mode device operation for the thin film transistors with P-doped (Zn,Mg)O as the active channel layer.; P-type phosphorus-doped (Zn0.9Mg0.1)O films have been realized via PLD without post-annealing process. The conduction type of the films strongly depends on the oxygen partial pressure during the deposition process. Increasing the oxygen partial pressure from 20 to 200 mTorr yielded a carrier type conversion from n-type to p-type. The P-doped (Zn,Mg)O films grown at 150 mTorr oxygen partial pressure were p-type and exhibited a hole concentration of 2.7 x 1016 cm-3, a mobility of 8.2 cm2/Vs and a resistivity of 35 O-cm.; (Zn0.9Mg0.1)O:P/ZnO heterostructures were fabricated on sapphire and ZnO substrates via PLD with Au and Ti/Au served as Ohmic contacts. Both structures exhibit rectifying electrical characteristics. The turn-on voltages were determined to be 1.36 V and 1.15 V for the structure grown on sapphire and ZnO substrate, respectively.; The resistivity of Al-doped ZnO depends on growth temperature, laser energy and oxygen pressure. The photoluminescence properties of the Al-doped ZnO films have strong correlations to the electrical properties and crystallinity of the films. The possibility of the non-radiative trapping through deep level defect states decreases with increasing the electron density of Al-doped ZnO films. AFM results showed that the root-mean-square roughness increases with growth temperature and oxygen partial pressure.; The resistivity of the as-deposited 0.2 at.% P-doped films grown in ozone/oxygen ambient rapidly increased with growth temperature. The improvement in band edge emission intensity for the films grown in O2/Ar/H2 mixture may reflect the passivation effect of the deep acceptor-related levels by hydrogen, which also yields the passivation of the deep level emission. Oxygen interstitials may contribute to the deep level emission of RT-PL for annealed P-doped ZnO films.
机译:通过光刻和湿法化学蚀刻工艺在玻璃基板上制造了顶栅型ZnO基TFT。使用脉冲激光沉积(PLD)沉积ZnO层。对于未掺杂的ZnO和P掺杂的ZnO薄膜晶体管,显示了N沟道耗尽模式操作。电流-电压测量结果表明,以P掺杂(Zn,Mg)O作为有源沟道层的薄膜晶体管具有增强模式的器件操作。 P型磷掺杂(Zn0.9Mg0.1)O薄膜已通过PLD实现,无需进行后退火处理。膜的导电类型在很大程度上取决于沉积过程中的氧分压。氧分压从20 mTorr增加到从n型到p型的载流子类型转化。在150 mTorr的氧分压下生长的P掺杂(Zn,Mg)O薄膜为p型,空穴浓度为2.7 x 1016 cm-3,迁移率为8.2 cm2 / Vs,电阻率为35 O-cm 。;通过以Au和Ti / Au作为欧姆接触的PLD在蓝宝石和ZnO衬底上制造了(Zn0.9Mg0.1)O:P / ZnO异质结构。两种结构均表现出整流电特性。对于在蓝宝石和ZnO衬底上生长的结构,导通电压分别确定为1.36 V和1.15V。 Al掺杂的ZnO的电阻率取决于生长温度,激光能量和氧气压力。铝掺杂ZnO薄膜的光致发光性质与薄膜的电学性质和结晶度具有很强的相关性。随着铝掺杂ZnO薄膜电子密度的增加,通过深能级缺陷态发生非辐射俘获的可能性降低。 AFM结果表明,均方根粗糙度随生长温度和氧分压而增加。随着生长温度的增长,在臭氧/氧气环境中生长的沉积了0.2 at。%P的薄膜的电阻率迅速增加。在O2 / Ar / H2混合物中生长的薄膜的能带边缘发射强度的改善可能反映了氢引起的深受主相关能级的钝化作用,这也产生了深能级发射的钝化作用。氧间隙可能有助于退火的P掺杂ZnO薄膜的RT-PL深层发射。

著录项

  • 作者

    Li, Yuanjie.;

  • 作者单位

    University of Florida.;

  • 授予单位 University of Florida.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2006
  • 页码 124 p.
  • 总页数 124
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

  • 入库时间 2022-08-17 11:40:37

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