Lead Free Soldering and Environmental Compliance: Supply Chain Readiness Challenges

机译：无铅焊接和环境遵守：供应链准备和挑战

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Supply chain readiness and compatibility are critical to a smooth transition to environmental compliance for the worldwide electronics industry. This paper reviews the status of Lead Free soldering and RoHS compliance, supply chain readiness, key compatibility issues and future challenges.

机译：供应链准备和兼容性对全球电子行业的环境依从性平滑过渡至关重要。本文审查了无铅焊接的地位和RoHS合规性，供应链准备，关键兼容性问题和未来挑战。

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《IPC Printed Circuits Expo, Apex, and the Designers Summit》|2006年||共3页
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Dongkai Shangguan; IPC;
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专利

1. The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge [J] . W J Plumbridge, C R Gagg Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications . 2000,第3期

机译：含铅和无铅焊料的机械性能-应对环境挑战
2. Lead-Free, Not Necessarily Stress-Free: Managing compliance in the global supply chain [J] . Kenneth Wong Cadalyst: Integrating Technology for Manufacturing, AEC and GIS . 2006,第5期

机译：无铅，不必无压力：管理全球供应链中的合规性
3. Integrated hybrid life cycle assessment and supply chain environmental profile evaluations of lead-based (lead zirconate titanate) versus lead-free (potassium sodium niobate) piezoelectric ceramics [J] . Ibn-Mohammed T., Koh S. C. L., Reaney I. M., Energy & environmental science . 2016,第11期

机译：铅基（锆钛酸铅钛酸盐）与无铅（铌酸钾钠）压电陶瓷的混合寿命周期综合评估和供应链环境概况评估
4. Lead Free Soldering and Environmental Compliance: Supply Chain Readiness Challenges [C] . Dongkai Shangguan IPC Printed Circuits Expo, Apex, and the Designers Summit vol.1; 20060205-10; Anaheim,CA(US) . 2006

机译：无铅焊接与环境合规：供应链准备与挑战
5. Study of the use of the Weibull distribution and compliance of the reliability of lead-free solder in accelerated thermal cycling through varying solder volume, pitch, and thermal range with previously established materials models. [D] . Berger, Barry Nathaniel. 2012

机译：使用先前建立的材料模型，通过改变焊料量，间距和热范围，研究威布尔分布的使用以及无铅焊料在加速热循环中的可靠性是否符合要求。
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. Environmentally-Acceptable Mounting Technology. Lead-Free Solder Paste and VOC-Free Solder Paste. [O] . Yasuhiro ASANO 1998

机译：环境可接受的安装技术。无铅焊膏和VOC - 无焊膏。

Lead Free Soldering and Environmental Compliance: Supply Chain Readiness Challenges

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