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Supply manner and solder vessel of lead free cylindrical solder to solder vessel

机译:无铅圆柱形焊料向焊料容器的供应方式和焊料容器

摘要

Topic You do not have to mix the lead absolutely in the solder vessel of the lead free solder. Differing form of the proverb lead free cylindrical solder with the form of the lead entering cylindrical solder, when it leaves the lead entering cylindrical solder in the vicinity of the solder vessel, there was a thing where this is entered to the solder vessel. SolutionsThis invention makes the lead entering cylindrical solder and the lead free cylindrical solder pass where form differs on solder vessel top, but the lead entering cylindrical solder installs the passing section which is not made to pass, in the solder vessel when entering tries to enter from said passing section. Choice figure Drawing 1
机译:<主题>您不必在无铅焊料的焊料容器中完全混合铅。众所周知的无铅圆柱状焊料的形式与进入圆柱状焊料的形式不同,当将铅进入圆柱状焊料的焊料留在焊料容器附近时,就会进入焊料容器。解决方案本发明使进入圆筒形焊料的引线和无铅圆筒形焊料通过在焊料容器顶部形状不同的地方,但是进入圆筒形焊料的引线在焊料进入容器中安装了不通过的通过部分,试图从焊料进入说通过部分。 <选择图>图1

著录项

  • 公开/公告号JP4222441B1

    专利类型

  • 公开/公告日2009-02-12

    原文格式PDF

  • 申请/专利权人 千住金属工業株式会社;

    申请/专利号JP20080523833

  • 发明设计人 中村 秀樹;

    申请日2007-06-19

  • 分类号B23K1/08;B23K3/06;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 19:38:26

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