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Tin Whisker Growth under Cycling Current Pulse

机译:循环电流脉冲下的罐晶须生长

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摘要

A new test method, called as cycling current pulse method, was developed to evaluate the trend of whisker growth, which the cycling current pulse was first applied for cyclical heating and cooling on the tin coating sample in order to accelerate the whisker growth. The loading current in samples was controlled by the device composed of α-simple Applied Controller and a constant current source, and the working current density varied from 5 × 10{sup}4A/dm{sup}2 to 10 × 10{sup}4A/dm{sup}2. It resulted in temperature of the samples varied from 40°C to 75°C, and both heating and cooling dwell time per cycle were 5 min, 0-2200 cycles (about 15 days) were carried out in present work. Tin whisker growth on surface finish is observed by SEM after different cycles; the results showed that the longest fluted whisker about 120 microns in length was observed after 2200 cycles current pulse test. As a comparison with the isothermal condition, there was a relative short incubation period in cycling current pulse test at current density 5×10{sup}4A/dm{sup}2. However, at current density of 10 × 10{sup}4A/dm{sup}2 , whisker growth was slowdown, the reason is not clear now. Present work shows that the cycling current pulse method is effective to evaluate the trend of whisker growth.
机译:一个新的测试方法,称为循环电流脉冲的方法,被开发用于评价晶须生长,这是首次在为了加速晶须生长施加周期性的加热和冷却上锡涂层样品的循环电流脉冲的趋势。样品中的负载电流是由α-简单应用控制器和一个恒流源组成的装置,该工作电流密度为5×10 {SUP} 4A /分米{SUP} 2〜10×10 {SUP}改变控制图4A /分米{SUP} 2。它导致了从40℃变化至75℃的样品的温度,并且加热和每循环冷却停留时间为5分钟,0-2200个循环(约15天)在目前的工作中进行。锡晶须上表面光洁度生长通过SEM不同周期后观察到该结果表明,在2200周之后的周期电流脉冲测试中观察大约在长度120微米的最长凹槽的晶须。由于与等温条件的比较,有在电流密度为5×10 {SUP} 4A /分米{SUP} 2循环电流脉冲试验的相对短的潜伏期。然而,在10×10 {SUP} 4A /分米{SUP} 2的电流密度,晶须生长放缓,原因是没有立即清除。目前的工作表明,循环电流脉冲的方法是有效的评价晶须增长的趋势。

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