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Hybrid Interconnects Using Silicon/FR-4 Substrates for Board-Level 10 Gb/s Signal Broadcasting

机译:混合互连使用用于板级10 GB / S信号广播的硅/ FR-4基板

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An opto/digital interconnect prototype for board-level 1 × 4 optical-to-digital signal broadcasting operating at 10 Gb/s per channel over an interconnect distance of 10 cm is demonstrated. An improved 1 × 4 multimode interference (MMI) splitter at 1550 nm with linearly-tapered output facet is heterogeneously integrated with 4 p-i-n photodetectors (PDs) on a Silicon (Si) bench. The Si bench itself is hybrid integrated onto an FR-4 printed-circuit board (PCB) with 4 receiver channels. A novel fabrication/integration approach demonstrates the capability of simultaneously aligning multiple polymer waveguides with multiple optoelectronic (OE) devices during the waveguide fabrication process. The combined excess loss of the MMI splitter and the miorr loss per channel is less than 3.5 dB and the entire system is fully functional at 10 Gb/s.
机译:对电路板级的光学/数字互连原型在10cm的互连距离上以10gb / s以10gb / s运行的光学/数字互连原型。具有线性锥形输出刻面的1550nm处的改进的1×4多模干扰(MMI)分路器在硅(Si)工作台上与4个P-I-N光电探测器(PDS)无渗透地集成。 Si台凳本身是集成在FR-4印刷电路板(PCB)上的混合动力车,具有4个接收器通道。一种新颖的制造/整合方法证明了在波导制造过程中与多个光电(OE)器件同时对准多个聚合物波导的能力。 MMI分离器的组合过量损失和每个通道的MIORR损失小于3.5dB,整个系统在10 GB / s处完全正常工作。

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