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Opportunities and Challenges in Silicon Photonics

机译:硅光子学的机遇与挑战

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The unprecedented maturity of silicon materials, processing, and device technologies, stemming from R&D investments now exceeding USD40B annually, clearly offers an enticing opportunity for leveraging into photonics applications and markets. Silicon-on-insulator (SOI) in particular provides many attractive design attributes for photonic circuits. Inherent physical benefits include a very high index contrast, enabling ultra-small bend radius index-guided circuits and devices[1], and a variety of high-performance photonic crystal concepts[2]. While silicon has historically not been viewed as a high-performance active optical material, recent work has now demonstrated that devices based upon plasma index mechanisms[3] can be quite efficient in field-effect configurations, effectively bypassing the previous bandwidth limitations of thermo-optic devices or forward-injection designs. Ge-based detectors, implemented with SiGe VLSI epitaxy technologies, have demonstrated high-performance waveguide designs, and recently even full silicon integrated photoreceivers at bandwidths as high as 17 Gb/s[4]. The result of these studies is a nearly full suite of active and passive photonics devices that can be implemented with very high density and yield using commercial CMOS foundry technologies, with well-documented low costs per unit wafer area. In addition to broad progress in the international research community, there has been significant recent acceleration enabled by DARPA's EPIC program[5,6], as well as impressive advances from start-up companies pursuing product development or deployments in concert with major silicon foundry partners.
机译:硅材料,加工和设备技术的前所未有的成熟,源于每年超过40亿美元的研发投资,明确地提供了利用光子学应用和市场的诱惑机会。绝缘体(SOI)特别为光子电路提供许多有吸引力的设计属性。固有的物理效益包括非常高的索引对比度,使超小型弯曲半径指导导向电路和装置[1],以及各种高性能光子晶体概念[2]。虽然Silicon历史上未被视为高性能的主动光学材料,但最近的工作现已表明,基于等离子体索引机制[3]的器件可以在现场效果配置中非常有效,有效地绕过了热量的先前带宽限制光学器件或前注射设计。基于GE基于SiGe VLSI外延技术的探测器已经展示了高性能波导设计,最近甚至具有高达17 GB / S的带宽的全硅集成光剖录。这些研究的结果是几乎全面的主动和被动光子仪装置,可以用非常高的密度和使用商业CMOS铸造技术实现,并且每单位晶片区域具有良好地记录的低成本。除了国际研究界的广泛进展外,DARPA史诗计划(5,6]而启用了最近的近期加速,以及初创公司追求产品开发或部署与主要硅铸造伙伴的音乐会令人印象深刻。

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