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Method for fabricating silicon photonics package, active alignment method for light coupling, and silicon photonics package
Method for fabricating silicon photonics package, active alignment method for light coupling, and silicon photonics package
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机译:硅光子封装的制造方法,用于光耦合的有源对准方法以及硅光子封装
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摘要
A silicon photonics package includes an L-shaped block formed from a cuboid having a through-hole through front and rear faces thereof. The L-shaped block includes two horizontal inner surfaces lying in a plane longitudinally bisecting a section of the through-hole, a bisected through-hole formed between the two horizontal inner surfaces, and a vertical inner surface. A lens block with a lens or lens array is bonded on the rear face of the L-shaped block. A vertical metal pad is attached on the front face of the L-shaped block. The vertical metal pad is soldered together with two horizontal metal pads on a photonic integrated circuit block formed with a waveguide or waveguide array such that the center of the optical lens is optically aligned with the waveguide. A method for fabricating the silicon photonics package, and an active alignment method for light coupling are also disclosed.
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