Imec, Kapeldreef 75, Heverlee B-3001, Belgium;
Centre for Microsystems Technology, imec and Ghent University, Technologiepark-Zwijnaarde 15, Ghent B-9052, Belgium;
Photonics Research Group, Ghent University-imec, Ghent 9000, Belgium;
Imec, Kapeldreef 75, Heverlee B-3001, Belgium;
Centre for Microsystems Technology, imec and Ghent University, Technologiepark-Zwijnaarde 15, Ghent B-9052, Belgium;
Imec, Kapeldreef 75, Heverlee B-3001, Belgium;
Lenses; Photonics; Microoptics; Silicon; Substrates; Couplers; Couplings;
机译:扩展梁背面耦合界面,用于对准硅光子的耐受封装
机译:用于硅上耦合到绝缘体光子线波导的对准宽容宽带小锥形
机译:具有MEMS主动对准功能的硅平台及其在Si光子封装中的潜在应用
机译:扩展梁通过基板耦合界面,用于对准硅光子的耐受包装
机译:半导体激光器,用于与单模光纤的低损耗,对准公差耦合
机译:100 Gb / s硅光子WDM发射器具有耐未对准的表面-正常光接口
机译:扩展光束背面耦合界面,用于硅光子的对准耐受包装
机译:用于密封光子封装的单模光纤阵列对准的无源微机械设备 - CLasp概念