SiP - IDENTIFYING ISSUES FOR STACKED (3D) MULTICHIP PACKAGING ADOPTION

摘要

The term "packaging" as applied to microelectronics, delineates the materials, processes and methods for providing a satisfactory electrical, mechanical and thermal operating environment for an integrated circuit (IC). The resulting "packaged" device is termed a module. The term multi-chip module (MCM) was introduced in the mid-1990s as a technology that incorporated several unpackaged ICs on an interconnecting substrate. There was a flurry of activity to develop high-performance interconnecting substrates that could wring the utmost in performance from the bare, bumped or TAB'ed IC device. Advanced packaging came to be viewed as a value added process that offered the utmost performance with the smallest form factor (size and weight) for critical applications where cost was not the prime consideration. The resulting MCM developments gained a reputation as overpriced solutions good for solving niche problems only.