Shipments of wafer level packages (WLPs) have exceeded expectations, both in the number of units shipping and size and complexity of the devices. Once relegated to the few I/O range, wafer level packages are routinely shipping with more than 100 I/Os. They type of devices shipping in WLPs are expanding from integrated passives and analog devices, to a variety of integrated circuits including RF and memory. While many of the early parts were on 6-inch wafers, companies have migrated to 8-inch wafers and some companies will use 12-inch wafers in the future. What difficulties will be encountered with the expansion of WLPs? What are the opportunities for companies providing fabrication services, equipment, and materials? This paper examines the current status and provides projections for the future.
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机译:晶圆级包装(WLP)的出货量已超出预期,无论是单位运输和设备尺寸和复杂性的数量。一旦被降级到少数I / O系列,晶圆级包装常规运输超过100 I / O.它们类型在WLPS中运输的设备从集成的无源和模拟设备扩展到各种集成电路,包括RF和内存。虽然许多早期部件在6英寸晶圆上,但公司已迁移到8英寸晶圆,并将在未来使用12英寸晶圆。 WLP的扩展将遇到什么困难?提供制造服务,设备和材料的公司有哪些机会?本文介绍了当前状态,并为未来提供预测。
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