Rapid Design of High Performance 25+ GT/s Vias by Application of Decomposition and Image Impedance

摘要

Traditional high speed via design views the structure as a whole and relies on intuitionguided iteration. This technique often requires heavy time investment when applied to electrically large structures and/or results in a poorly understood final structure. An alternative design technique is presented and validated by example; existing decomposition techniques are combined and expanded upon to design a variable length differential via with a stub as several elements that are examined in isolation. Image impedance theory is summarized and applied as part of a simple tuning strategy to enable reliably length independent design. This method enables designers to create 25+ GT/s vias quickly, deliberately, and with much less uncertainty than the traditional technique.